分享一篇ST ISM330DHCXiNEMO慣性模塊工業0應用方案

ST公司的ISM330DHCX是系統級封裝 iNEMO慣性模塊,具有機器學習內核,有限狀態機(FSM)和數字輸出.器件具有高性能3D數字加速度計和3D數字陀螺儀,特別為工業4.0應用而設計.ST公司的各種傳感器元件采用特別的微機電技術制造,而IC接口采用CMOS技術,使得專用電路的設計能更好地和傳感元件特性更好地匹配.ISM330DHCX 全范圍加速度范圍為±2/±4/±8/±16g,而角速率范圍為±125/±250/±500/±1000/ ±2000/±4000dps,使得器件有廣泛的應用。

ISM330DHCX無與倫比的嵌入特性(機器學習核,可編FSM,FIFO,傳感器集線器,事件譯碼和中斷)可以實現智能和復雜的傳感器節點,以非常低的功耗提供高性能. ISM330DHCX采用14引腳LGA封裝.模擬工作電壓1.71 V到3.6 V,工作溫度-40 到 +105 ℃ .主要用在工業IoT和連接設備,天線,平臺,光學圖像和透鏡穩定.機器人,無線機和工業自動化,導航系統和遠程信息處理,以及震動監視和補償.中電網為您整理如下詳細資料,本文介紹了ISM330DHCX主要特性,濾波器框圖,加速度計復合濾波器框圖,Mode 1/2/3&4的ISM330DHCX電連接圖,加速度計框圖以及評估板STEVAL-MKI210V1K主要特性,電路圖和材料清單.

The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness.

The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enable its usage in a broad range of applications.

All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization.

An unmatched set of embedded features (Machine Learning Core, programmable FSM, FIFO, sensor hub, event decoding and interrupts) are enablers for implementing smart and complex sensor nodes which deliver high performance at very low power. The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.

ISM330DHCX主要特性:

3D accelerometer with selectable full scale: ±2/±4/±8/±16 g
3D gyroscope with extended selectable full scale: ±125/±250/±500/±1000/±2000/±4000 dps
Extended temperature range from -40 to +105 ℃
Embedded compensation for high stability over temperature
SPI/I2C serial interface
Auxiliary SPI serial interface for data output of gyroscope and accelerometer (OIS and other stabilization applications)
Six-channel synchronized output
Sensor hub feature to efficiently collect data from additional external sensors
Embedded smart FIFO up to 9 kbytes
Programmable Finite State Machine to process data from accelerometer, gyroscope, and external sensors Machine Learning Core
Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D orientation, click and double-click
Embedded pedometer, step detector and counter for healthcare applications
Analog supply voltage: 1.71 V to 3.6 V
Embedded temperature sensor
Embedded self-test both for gyroscope and accelerometer
High shock survivability
ECOPACK, RoHS and “Green” compliant

ISM330DHCX應用:

Industrial IoT and connected devices
Antennas, platforms, and optical image and lens stabilization
Robotics, drones and industrial automation
Navigation systems and telematics
Vibration monitoring and compensation

ISM330DHCX片上特性:

9 kbytes data buffering, data can be compressed two or three times
– 100% efficiency with flexible configurations and partitioning
– Possibility to store timestamp
Event-detection interrupts (fully configurable):
– Free-fall
– Wakeup
– 6D orientation
– Click and double-click sensing
– Activity/inactivity recognition
– Stationary/Motion detection
Specific IP blocks with negligible power consumption and high-performance:
– Finite State Machine (FSM) for accelerometer, gyroscope, and external sensors
– Machine Learning Core (MLC)
– Significant Motion Detection, tilt, pedometer, step detector and step counters
Sensor hub
– Up to 6 total sensors: 2 internal (accelerometer and gyroscope) and 4 external sensors

圖1.濾波器框圖

圖2.加速度計復合濾波器框圖

圖3.Mode 1的ISM330DHCX電連接圖

圖4.Mode 2的ISM330DHCX電連接圖

圖5.Mode 3和Mode 4的ISM330DHCX電連接圖

圖6.加速度計框圖

評估板STEVAL-MKI210V1K

iNemo inertial module kit based on ISM330DHCX
The STEVAL-MKI210V1 evaluation board has an embedded ISM330DHCX 3D accelerometer and 3D gyroscope sensor, which is connected through flat cable to a simple adapter board (STEVAL-MKIGIBV2) to render it compatible with STEVALMKI109V3.

The sensor is soldered precisely in the center of the board and double-sidedadhesives are provided to allow users to conveniently mount the board on equipmentdestined for vibration analysis. Alternatively, you can mount the board using the holeslocated in each corner of the PCB.

The STEVAL-MKIGIBV2 can be plugged into a standard DIL 24 socket. The kitprovides the complete IIS3DWB pin-out and comes ready-to-use with the requireddecoupling capacitors on the VDD power supply line.

This adapter is supported by the STEVAL-MKI109V3 motherboard with highperformance 32-bit microcontroller functioning as a bridge between the sensor and aPC, on which it is possible to use the downloadable graphical user interface (UnicoGUI), or dedicated software routines for customized applications.

評估板STEVAL-MKI210V1K主要特性:

? User friendly ISM330DHCX board
? Complete ISM330DHCX pinout for a standard DIL 24 socket
? Double-sided adhesives included for easy mounting on equipment to bemeasured
? Fully compatible with and STEVAL-MKI109V3 motherboard
? RoHS compliant