近期，2023中國(guó)·南沙國(guó)際集成電路產(chǎn)業(yè)論壇在廣州盛大召開(kāi)。作為國(guó)內(nèi)領(lǐng)先的系統(tǒng)級(jí)驗(yàn)證EDA解決方案提供商，芯華章科技應(yīng)邀出席“汽車(chē)芯片分論壇”，共同探討汽車(chē)芯片產(chǎn)業(yè)的新機(jī)遇。芯華章科技汽車(chē)電子事業(yè)部首席算法科學(xué)家張磊博士受邀發(fā)表《場(chǎng)景+芯片仿真賦能個(gè)性化汽車(chē)芯片》的主題演講，分享基于場(chǎng)景的系統(tǒng)級(jí)仿真對(duì)于主機(jī)廠構(gòu)建自主可控“芯”生態(tài)的廣闊應(yīng)用場(chǎng)景。

Recently, the 2023 China·Nansha International Integrated Circuit Industry Forum was grandlyheld in Guangzhou. As a leading provider of system-level verification EDAsolutions in China, X-EPIC was invited to attend the "Automotive Chip Sub-Forum" todiscuss new opportunities in the automotive chip industry. Dr. Zhang Lei, ChiefAlgorithm Scientist of X-EPIC Automotive Electronics Division, was invitedto deliver a keynote speech on "Scene + Chip Simulation EmpoweringPersonalized Automotive Chips", sharing the importance of scenario-basedsystem-level simulation for OEMs to build an independent and controllable"core" ecology broad applications.

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張磊博士簡(jiǎn)介

About Dr. Zhang Lei

中科院計(jì)算所工學(xué)博士學(xué)位

武漢大學(xué)數(shù)學(xué)系本科

前SAS中國(guó)區(qū)首席科學(xué)家

TeraData&IBM近二十年算法和數(shù)據(jù)挖掘經(jīng)驗(yàn)

He holds Ph.D. in Engineering from theInstitute of Computing Technology, Chinese Academy of Sciences

Bachelor of Mathematics, Wuhan University

Former Chief Scientist of SAS ChinaHe has nearly 20 years of experience indata algorithms and data mining in TeraData & IBM.

隨著汽車(chē)產(chǎn)業(yè)新四化的演進(jìn)，在智能化的下半場(chǎng)，主機(jī)廠與其產(chǎn)業(yè)配套供應(yīng)商已經(jīng)意識(shí)到，產(chǎn)品的功能和體驗(yàn)不僅僅依靠軟件定義來(lái)實(shí)現(xiàn)，同時(shí)更加需要芯片定義的支持，才能在滿足性能和安全性的同時(shí)，給用戶提供具有更高性價(jià)比的方案與產(chǎn)品。

With the evolution of the New Four Modernizations of the automobile industry, in the second half of theintelligentization，both original equipmentmanufacturers (OEMs) and their industry suppliers have recognized that thefunctionality and user experience of products rely not only on softwaredefinition but also on chip definition. This support from chip definition isessential to provide users with solutions and products that offer highercost-effectiveness while meeting performance and safety requirements.

在整車(chē)架構(gòu)趨同、功能同質(zhì)化嚴(yán)重的智能汽車(chē)時(shí)代，重“芯”構(gòu)建生態(tài)，給車(chē)主帶來(lái)更加個(gè)性化的場(chǎng)景體驗(yàn)，就需要更智能化的算法和超性價(jià)比系統(tǒng)方案。但是今天，一款車(chē)型的SOP大概需要36~48個(gè)月，芯片的開(kāi)發(fā)周期也需要24~36個(gè)月。9成以上的在售新車(chē)型，都在用上一代芯片。讓新車(chē)不再用“舊“芯片是芯華章仿真車(chē)希望賦能行業(yè)解決的核心問(wèn)題。

In the era of smart cars with similarvehicle architectures and function homogeneity, more intelligent algorithms andsuper cost-effective system solutions are needed to focus on "core"to build an ecology and bring more personalized scene experiences to carowners. But today, the SOP of a car model takes about 36-48 months, and thechip delivery cycle also takes 24-36 months. More than 90% of the new models onsale are using the previous generation of chips. Making new cars no longer use"old" chips is the core problem that X-EPIC car simulation solutionaims to solve.

?2021年6月10日，芯華章正式發(fā)布了《EDA 2.0白皮書(shū)》。

June 10, 2021, X-EPIC officially released "EDA 2.0 White Paper"

芯華章科技董事長(zhǎng)兼CEO王禮賓：

Mr. Wang Libin, Chairmanand CEO of X-EPIC

智能化的EDA 2.0時(shí)代，會(huì)使設(shè)計(jì)芯片像開(kāi)發(fā)程序那樣簡(jiǎn)單，制造芯片像搭積木那樣靈活，這個(gè)未來(lái)并不遙遠(yuǎn)，技術(shù)已經(jīng)在路上，芯華章有信心讓EDA 2.0誕生在中國(guó)，誕生在離未來(lái)最近的地方。

Inthe era of intelligent EDA 2.0, designing chips will be as simple as software programing,manufacturing chips are as flexible as building legos, this future is not faraway, the technology is already on the way, X-EPIC is confident in bringingabout the birth of EDA 2.0 in China, right at the forefront of the future. 深耕汽車(chē)電子產(chǎn)業(yè)，芯華章對(duì)EDA 2.0踐行和突破。在芯華章的仿真車(chē)解決方案中，借助自主研發(fā)的高性能硬件仿真系統(tǒng)HuaEmu E1：

• 用戶能夠針對(duì)不同的應(yīng)用場(chǎng)景，來(lái)預(yù)判車(chē)輛在實(shí)際使用過(guò)程中出現(xiàn)的風(fēng)險(xiǎn)；

• 實(shí)現(xiàn)軟硬件的開(kāi)發(fā)解耦和前置，幫助主機(jī)廠縮短研發(fā)周期；

• 降低學(xué)習(xí)門(mén)檻，豐富開(kāi)發(fā)工具的同時(shí)優(yōu)化硬件設(shè)計(jì)；

• 更快進(jìn)階到個(gè)性化定義EEA系統(tǒng)，縮短產(chǎn)品上市時(shí)間，在激烈的市場(chǎng)競(jìng)爭(zhēng)中贏得先機(jī)

Deeply cultivating in the automotiveelectronics industry is the practice and breakthrough of X-EPIC's EDA 2.0. InX-EPIC's car simulation solution, with the help of the self-developedhigh-performance emulation system HuaEmu E1:

• Users can predict the risks of vehicles in actual use for differentscenarios.

• Decouple of software and hardware development from early on, helpOEMs shrink the R&D cycle.

• Flatten the learning curve, enrich the development tools andoptimize the hardware design.

• Advance to the customized definition of the EEA system, shorten thetime to market, and take the leading position in new market competition.

目前，芯華章的仿真車(chē)解決方案，已經(jīng)率先在國(guó)內(nèi)頭部主機(jī)廠和Tier1方案上中得到突破性嘗試。智己汽車(chē)整車(chē)研發(fā)中心副總工程師兼架構(gòu)及整車(chē)集成部總監(jiān)康飛表示：

• 在車(chē)規(guī)芯片的應(yīng)用、測(cè)試過(guò)程當(dāng)中，需要與搭載的軟件提前進(jìn)行配合，才能夠降低芯片在整車(chē)應(yīng)用過(guò)程中的風(fēng)險(xiǎn)，確保低故障的同時(shí)，又能夠讓芯片的性能真正的發(fā)揮。

• 一款優(yōu)秀的場(chǎng)景和芯片仿真驗(yàn)證工具，可以幫助解決時(shí)間、人才、工具等三方面的挑戰(zhàn)，更快地進(jìn)行定制化芯片的研發(fā)，降低開(kāi)發(fā)人才門(mén)檻，縮短開(kāi)發(fā)周期，降低各項(xiàng)風(fēng)險(xiǎn)。

• 芯片和應(yīng)用軟件的協(xié)同開(kāi)發(fā)是未來(lái)汽車(chē)領(lǐng)域產(chǎn)品差異化及提升用戶體驗(yàn)的關(guān)鍵點(diǎn)之一，借助強(qiáng)大的仿真、定義、驗(yàn)證工具，能夠幫助產(chǎn)品實(shí)現(xiàn)更好的差異化，從而為用戶提供更高性價(jià)比的產(chǎn)品。

At present, X-EPIC's car simulationsolution has taken the lead in making breakthrough attempts in domestic headOEMs and Tier1 solutions.Kang Fei, Deputy Chief Engineer andDirector of Architecture and Vehicle Integration Department at Zhiji AutomotiveResearch and Development Center says:

• In the application and testing process of automotive-grade, it isnecessary to coordinate with the embedded software in advance in order toreduce risks during the chip's integration into the vehicle system. Thisensures both low failure rates and the optimal performance of the chip.
• An excellent scenario and chip simulation verification tool can helpaddress challenges in terms of time, talent, and tools. It enables fasterdevelopment of customized chips, reduces the talent threshold for development,shortens the development cycle, and mitigates various risks.
• The collaborative development of chips and application software isone of the key factors for product differentiation and improving userexperience in the future automotive industry. With powerful simulation,definition, and verification tools, products can achieve betterdifferentiation, thus providing us with higher cost-effective solutions.

芯華章先進(jìn)的系統(tǒng)級(jí)場(chǎng)景仿真平臺(tái)和協(xié)同驗(yàn)證平臺(tái)，幫助汽車(chē)電子加快下一代電子電氣架構(gòu)的“芯”迭代，賦能客戶構(gòu)建“芯”生態(tài)，掌握“芯”動(dòng)力。

X-EPIC's advanced system-level scenariosimulation platform and collaborative verification platform, help automotiveelectronics accelerate the "core" iteration of the next-generationelectrical and electronic architecture, empowering customers to create an"SoC" ecosystem and harness the full potential of "SoC"technology.