The new STV200N55F3 and STV250N55F3 are state-of-the-art 55 V devices, manufactured with ST’s proprietary planar STripFET™ III technology. Housed in the innovative PowerSO-10™ package, their exclusive ribbon bonding technique results in an outstanding performance in terms of extremely low on-resistance and high current capacity. In fact, the STV250N55F3 achieves one of the lowest R_DS(on) values available on the market for a single discrete device.
The die housed in the PowerSO-10 package has already been qualified in both the D²PAK and TO-220 packages with the following part numbers:
STB185N55F3 in D²PAK (automotive grade)
STP185N55F3 in TO-220 (automotive grade)
STB180N55F3 in D²PAK for industrial applications
STP180N55F3 in TO-220 for industrial applications.