There is a significant gap developing between device speed and
performance, and overall system performance. Many devices have on-chip
speeds 2 to 4 times that of the system. This limitation can be partly due to
the design of the interconnect system. In many cases, however, the
materials used to interconnect the components can be the determining
factor? in final system speeds.
This paper will present the following:
The different materials used in a system to interconnect components.
How the materials individually effect signal and power management.
How this collectively inter-relates to overall system performance.
The composition of the materials used in the interconnect components (in
both the IC packages and the printed circuit boards) will be described.
Finally, guidelines and suggestions on how to test, when to test, and what to
do with the data will be proposed. The intent is to provide an insight into an
area that could lead to a competitive edge in production and technology.